|
Labtech Microwave’s low cost MMIC packaging
techniques offer significant
flexibility and can be adapted to cater for a wide range of MMIC
designs, cavity
dimensions and flexible footprint options. Labtech can also offer
a package
design and assembly service.
Four technical
reasons to choose Labtech
Microwave MMIC packaging solutions
We deliver innovative multichip module type
cavity packages that demonstrates
excellent thermal characteristics particularly through to the
ground plane and by
raising the MMICs in precisely laser
machined cavities - the resultant optimisation
|
of short bond wire lengths ensures minimal loss of chip performance.
Single chip and MCM packages
Auto assembly & Microwave
test of packages
SMD, drop in & BGA footprints
|
 |
|
|
For more information on
Labtech Microwave visit
www.labtechmicrowave.com
|
