Press release

Presteigne, UK
17th April 2001

LABTECH SHOWCASES MMIC CAPABILITY

Labtech, part of the Intelek Group and UK-based manufacturer of microwave printed circuit boards, announces that it will be launching its MMIC packaging capability at three major wireless communications events during May : MIOP, MTT-S and IMAPS.

MIOP (Mikrowellen und Optronik/Microwaves and Optronics), the German Wireless Week, will take place at the Congress-Centrum B in Stuttgart on 8th and 9th May. Labtech will be located at booth 97 + 98

The MTT-S Exhibition, hosted by the International Microwave Symposium, will be held in the Phoenix Civic Plaza, Phoenix, Arizona, from May 22nd to May 24th. Labtech will be located at booth 3019

IMAPS (International Microelectronics and Packaging Society) Europe 2001, will take place at the Palais de la Musique et des Congres, Strasbourg from May 30th to June 1st. Labtech will be located at booth B15

Bob Lowther, Labtech's Sales and Marketing Director, comments "Labtech is experiencing a major growth in demand for circuits incorporating MMIC (Monolithic Microwave Integrated Circuits) devices as it is ideal for applications operating at 18 GHZ and above and it enables our customers to achieve very high levels of integration and offer smaller, less power hungry equipment to their end-users. Labtech has recently commissioned a new MMIC packaging facility and introduced a MMIC- friendly autocatalytic electroless palladium finish. It estimated that a total of 15 thousand people will be attending these events, giving us an ideal opportunity to tell the microwave world about our new world-class capability."

Products Available

• Metalbacked PCBs
• Precision s/sided & d/sided softboard PTFE PCBs
• Multilayer Circuit Boards (PCBs)
• DLVAs
• PIN diode switches
• Multioctave broadband amplifiers
• TDM modules
• Active & passive microwave components
• Microwave thin film circuit manufacture
• RF machining & box build assembly