Presteigne, UK
31st March 2003
LABTECH NOW OFFERING LOW COST ORGANIC MILLIMETER-WAVE MMIC PACKAGES
Announces the development of MMIC custom packaging solutions utilising organic substrates and millimeter-wave PCB techniques.
Labtech has developed a low cost solution when compared to other alternative technologies and offers low cost NRE and tooling.
The current markets being addressed are for Ka/Ku band applications and the Optical components market.
Labtech's solution is not limited to larger quantities and small quantities typically less than or equal to 1K lot are being catered for.
Key Advantages
A schematic cross section of a packaging solution:
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Labtech has also developed new electroplating techniques to thicken the ground metal plate for high power versions of the packaging. See below:
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Multi-Chip Modules
Labtech also continues to develop interesting motherboard solutions for MMIC integration, wave guide launches by utilising mixed dielectric and metal core/backing techniques:

MIC Assembly — Turnkey Approach
Labtech's MIC assembly facility is housed in a Class 10,000 ESD protected clean room, using chip and wire bond techniques.
Labtech is able to bond directly to PTFE laminates using Gold, Ribbon and Aluminium wires.
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If this brief overview is interesting, please do not hesitate to contact Labtech for more detailed information and for future technical presentations.
Mr. John Priday - MMIC Packaging Specialist, Email: j.priday@labtech.ltd.uk
Mr. Bob Lowther - Sales & Marketing Director, Email: b.Lowther@labtech.ltd.uk
Labtech is a leading European manufacturer of Microwave PCB and MMIC Packaging Solutions with Worldwide representation and a major blue chip customer base.